| Feature |
Capability |
| Layer(mass production) |
2 to 24 Layers |
| Max Panel Size |
450mm*660mm |
| Copper Clad Laminate |
FR4,FR4(Halogen free),FR5,CEM-1 ,CEM-3 ,
PTFE,Rogers,Getek,BT,Polyimide,
Al Base,High-TG(TG>170 ℃ ) |
| Base Copper Thickness |
1/3oz-6oz |
| Impedance Control |
+/-8% |
| Board Thickness |
Min0.15mm,Max7.0mm |
| Minimum Thickness of CCL |
0.5mil (0.0875mm) (Include Cu) |
| Blind/Buried hole |
YES |
| Drilling (Minimum size) |
Mechanical drilling 8mil(0.2mm)
Laser drilling 4mil(0.1mm) |
| Inner Etching |
Minimum line/Space(A/W) 0.0625mm
Line Width Tolerance+/-8%
Board Thickness(min) 0.0625mm |
| Plating Hole |
Minimum Hole Size 6mil (0.15mm)
Aspect Ratio (max) 12:1
Position Accurary +/-1.8mil(0.045mm) |
| Microvia |
Minimum Hole Size 3mil(0.075mm)
Aspect Ratio (max) 1:1 |
| Outer Etching |
Minimum Width /Space 2.5mil(0.05mm)
Line Width Tolerance +/-0.4mil(0.01mm) |
| Solder Mask |
Bridge 3.0mil(0.075mm)
Position Accurary 1.5mil(0.0375mm) |
| Selective Gold Plating |
Gold Thickness 100u ″ (2.5um) |
| Press |
Thickness Tolerance 8%
Wrap/Twist 0.5%
Inner Opening (min) (1) 4/L:5mil(0.125mm)(2) 6/L-8/L:6mil(0.15mm)(3) 8/L or above:8mil(0.2mm) |
| Surface Treatment |
Hot Air Leveling,Gold/Nickel Plating,Immersion Gold/Tin/Sliver,Gold Finger, Peeable mask,Carbon Ink,OSP(Entek,F2) |
| Test |
AOI Test,Flying-needle Test,Fixture Test |
| Lead Time |
sample mass production :
S/D L:3days;4-8L:5-15days
S/D L:5days;4-8L:10-25days |
